Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Liu, Yu-Sian | en_US |
dc.contributor.author | Wen, Kuei-Ann | en_US |
dc.date.accessioned | 2019-04-02T05:58:19Z | - |
dc.date.available | 2019-04-02T05:58:19Z | - |
dc.date.issued | 2019-01-01 | en_US |
dc.identifier.issn | 2072-666X | en_US |
dc.identifier.uri | http://dx.doi.org/10.3390/mi10010050 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/148928 | - |
dc.description.abstract | This paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using the 0.18 m application-specific integrated circuit (ASIC)-compatible CMOS/MEMS process. An approximate analytical model for the spring design is presented. The experiments showed that the resonant frequency of the proposed tri-axis accelerometer was around 5.35 kHz for out-plane vibration. The tri-axis accelerometer had an area of 1096 m x 1256 m. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | accelerometer design | en_US |
dc.subject | spring design | en_US |
dc.subject | analytical model | en_US |
dc.title | Implementation of a CMOS/MEMS Accelerometer with ASIC Processes | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.3390/mi10010050 | en_US |
dc.identifier.journal | MICROMACHINES | en_US |
dc.citation.volume | 10 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000459735300049 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Articles |