完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChao, TSen_US
dc.contributor.authorLiaw, MCen_US
dc.contributor.authorChu, CHen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorChien, CHen_US
dc.contributor.authorHao, CPen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2019-04-02T05:58:33Z-
dc.date.available2019-04-02T05:58:33Z-
dc.date.issued1996-09-16en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.117484en_US
dc.identifier.urihttp://hdl.handle.net/11536/149302-
dc.description.abstractThe mechanism of the nitrogen co-implant to suppress the boron penetration in p(+)-polycrystalline silicon gate has been investigated. The nitrogen coimplant with the BF, combines with the boron to form a B-N complex which results in a retardation of boron diffusion. It is found that metal-oxide-silicon capacitors with nitrogen implantation show improved electrical properties. (C) 1996 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleMechanism of nitrogen coimplant for suppressing boron penetration in p(+)-polycrystalline silicon gate of p metal-oxide semiconductor field effect transistoren_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.117484en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume69en_US
dc.citation.spage1781en_US
dc.citation.epage1782en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996VG93400043en_US
dc.citation.woscount25en_US
顯示於類別:期刊論文