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dc.contributor.authorLee, Shean-Yihen_US
dc.contributor.authorChiou, Bi-Shiouen_US
dc.date.accessioned2019-04-02T06:01:10Z-
dc.date.available2019-04-02T06:01:10Z-
dc.date.issued2008-01-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.2837640en_US
dc.identifier.urihttp://hdl.handle.net/11536/149368-
dc.description.abstractThe effects of adding a Ba0.5Sr0.5TiO3 (BST) seeding layer of perovskite-based oxide CaCu3Ti4O12 (CCTO) thin films grown on Pt/TiN/SiO2/Si (100) substrates on crystallographic structure, surface morphology, dielectric loss, leakage current, and thermal stability were investigated. Adding a BST seeding layer to the interface between CCTO/Pt structures has remarkable influences on CCTO thin-film properties, including dielectric properties, insulating characteristics, and the temperature coefficient of capacitance (TCC), as well as thin-film grain sizes. CCTO films with a 2 nm BST seeding layer showed smaller grain sizes than those specimens of CCTO films without a BST seeding layer. The dielectric loss, leakage current density, surface roughness, and thermal stability (TCC) of CCTO films with a 2 nm BST seeding layer were improved by about 23%, 1 order of magnitude at 360 kV/cm, 38%, and 61%, respectively, compared with that of CCTO films without a BST seeding layer. The correlations of material properties, such as dielectric loss, leakage current, surface roughness, and thermal stability properties, suggest that adding a 2 nm BST seeding layer to CCTO films capacitor structure is another optimal choice for metal-insulator-metal device applications. (C) 2008 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleImproving dielectric loss and thermal stability of CaCu3Ti4O12 thin films by adding BST layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2837640en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume11en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentInnovative Packaging Research Centerzh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInnovative Packaging Research Centeren_US
dc.identifier.wosnumberWOS:000253238000018en_US
dc.citation.woscount1en_US
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