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dc.contributor.authorLeu, Ching-Chichen_US
dc.contributor.authorLin, Chen-Hanen_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.contributor.authorYang, Ming-Juien_US
dc.date.accessioned2019-04-02T06:01:05Z-
dc.date.available2019-04-02T06:01:05Z-
dc.date.issued2008-07-01en_US
dc.identifier.issn0884-2914en_US
dc.identifier.urihttp://dx.doi.org/10.1557/JMR.2008.0248en_US
dc.identifier.urihttp://hdl.handle.net/11536/149446-
dc.description.abstractWe investigated structural and characteristic changes in thin HfO2 films (< 10 nm) by varying their thicknesses and also examined their influence on the properties of Pt/SrBi2Ta2O9/HfO2/Si metal/ferroelectric/insulator/semiconductor (MFIS) structures. HfO2 films with different thicknesses were found to exhibit rather distinct characteristics and to profoundly affect the properties of the fabricated MFIS capacitor. We found that, when employing 3.2-nm-thick HfO2 as the buffer layer, the MFIS capacitor showed good memory performance at low operation voltage. However, this study demonstrated that some of the HfO2 limited its application in MFIS memory, even though it is the most promising alternative gate dielectric material.en_US
dc.language.isoen_USen_US
dc.titleEffects of HfO2 buffer layer thickness on the properties of Pt/SrBi2Ta2O9//HfO2/Si structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1557/JMR.2008.0248en_US
dc.identifier.journalJOURNAL OF MATERIALS RESEARCHen_US
dc.citation.volume23en_US
dc.citation.spage2023en_US
dc.citation.epage2032en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000257409800028en_US
dc.citation.woscount3en_US
Appears in Collections:Articles