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dc.contributor.authorTsai, JWen_US
dc.contributor.authorHuang, CYen_US
dc.contributor.authorTai, YHen_US
dc.contributor.authorCheng, HCen_US
dc.contributor.authorSu, FCen_US
dc.contributor.authorLuo, FCen_US
dc.contributor.authorTuan, HCen_US
dc.date.accessioned2019-04-02T05:59:32Z-
dc.date.available2019-04-02T05:59:32Z-
dc.date.issued1997-09-01en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.120435en_US
dc.identifier.urihttp://hdl.handle.net/11536/149629-
dc.description.abstractA short H-2 plasma treatment of the gate SiNx before depositing amorphous silicon (a-Si:H) is found to significantly decrease the threshold shifts in the bias stress, inverted a-Si:H thin film transistors (TFTs). The reduced threshold voltage shift is attributed to a plasma induced reconstruction of SiNx precursors leading to the removal of the weak bonds. A prolonged plasma treatment, however, degraded the TFT characteristics; this was traced H-2 plasma damage which eventually generated a rough a-Si:H/SiNx interface. (C) 1997 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleReducing threshold voltage shifts in amorphous silicon thin film transistors by hydrogenating the gate nitride prior to amorphous silicon depositionen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.120435en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume71en_US
dc.citation.spage1237en_US
dc.citation.epage1239en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997XU06200034en_US
dc.citation.woscount15en_US
Appears in Collections:Articles