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dc.contributor.authorLin, S. H.en_US
dc.contributor.authorChiang, K. C.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorYeh, F. S.en_US
dc.date.accessioned2019-04-02T06:00:13Z-
dc.date.available2019-04-02T06:00:13Z-
dc.date.issued2009-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2009.2022775en_US
dc.identifier.urihttp://hdl.handle.net/11536/149799-
dc.description.abstractWe have fabricated high-kappa Ni/TiO2/ZrO2/TiN metal-insulator-metal (MIM) capacitors. A low leakage current of 8 x 10(-8) A/cm(2) at 125 degrees C was obtained with a high 38-fF/mu m(2) capacitance density and better than the ZrO2 MIM capacitors. The excellent device performance is due to the lower electric field in 9.5-nm-thick TiO2/ZrO2 devices to decrease the leakage current and to a higher kappa value of 58 for TiO2 as compared with that of ZrO2 to preserve the high capacitance density.en_US
dc.language.isoen_USen_US
dc.subjecthigh kappaen_US
dc.subjectmetal-insulator-metal (MIM)en_US
dc.subjectTiO2en_US
dc.subjectZrO2en_US
dc.titleHigh-Density and Low-Leakage-Current MIM Capacitor Using Stacked TiO2/ZrO2 Insulatorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2009.2022775en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume30en_US
dc.citation.spage715en_US
dc.citation.epage717en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000267607900006en_US
dc.citation.woscount22en_US
Appears in Collections:Articles