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dc.contributor.authorPan, Tung-Mingen_US
dc.contributor.authorLi, Zhi-Hongen_US
dc.contributor.authorDeng, Chih-Kangen_US
dc.date.accessioned2019-04-02T05:58:00Z-
dc.date.available2019-04-02T05:58:00Z-
dc.date.issued2010-07-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2010.2047904en_US
dc.identifier.urihttp://hdl.handle.net/11536/149969-
dc.description.abstractIn this paper, we developed high-k Tb2O3 poly-Si thin-film transistors (TFTs) using different CF4 plasma power treatments. The high-k Tb2O3 poly-Si TFT device with a 20-W plasma power exhibited better electrical characteristics in terms of a highly effective carrier mobility, a high-driving current, a low-threshold voltage, a small subthreshold slope, and a high I-ON/I-OFF current ratio. This result is attributed to the incorporation of fluorine atoms into the Tb2O3/poly-Si interface to reduce the trap-state density. The high-k Tb2O3 poly-Si TFT prepared under a 20-W CF4 plasma power also enhanced electrical reliabilities, including hot carrier and positive bias temperature instability. All of these results suggest that the CF4 plasma-treated poly-Si Tb2O3 TFT is a good candidate for high-performance low-temperature poly-Si TFTs.en_US
dc.language.isoen_USen_US
dc.subjectCF4 plasma poweren_US
dc.subjecthigh-ken_US
dc.subjectinterface trap densityen_US
dc.subjectTb2O3en_US
dc.subjectthin-film transistors (TFTs)en_US
dc.titleEffects of CF4 Plasma Treatment on the Electrical Characteristics of Poly-Silicon TFTs Using a Tb2O3 Gate Dielectricen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2010.2047904en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume57en_US
dc.citation.spage1519en_US
dc.citation.epage1526en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000278995900006en_US
dc.citation.woscount11en_US
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