完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chu, Min-Ching | en_US |
dc.contributor.author | Meena, Jagan Singh | en_US |
dc.contributor.author | Cheng, Chih-Chia | en_US |
dc.contributor.author | You, Hsin-Chiang | en_US |
dc.contributor.author | Chang, Feng-Chih | en_US |
dc.contributor.author | Ko, Fu-Hsiang | en_US |
dc.date.accessioned | 2019-04-02T05:57:56Z | - |
dc.date.available | 2019-04-02T05:57:56Z | - |
dc.date.issued | 2010-08-01 | en_US |
dc.identifier.issn | 0026-2714 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.microrel.2010.05.004 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/149999 | - |
dc.description.abstract | We demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO2 film on a plastic polyimide substrate based on a simple and low-cost sal-gel precursor spin-coating process. The surface morphology of the ZrO2 film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO2 film under suitable treatment of oxygen (O-2) plasma and then subsequent annealing at 250 degrees C exhibits superior low leakage current density of 9.0 x 10(-9) A/cm(2) at applied voltage of 5 V and maximum capacitance density of 13.3 fF/mu m(2) at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O-2 plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O-2 plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature. (C) 2010 Elsevier Ltd. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.microrel.2010.05.004 | en_US |
dc.identifier.journal | MICROELECTRONICS RELIABILITY | en_US |
dc.citation.volume | 50 | en_US |
dc.citation.spage | 1098 | en_US |
dc.citation.epage | 1102 | en_US |
dc.contributor.department | 應用化學系 | zh_TW |
dc.contributor.department | 奈米科技中心 | zh_TW |
dc.contributor.department | Department of Applied Chemistry | en_US |
dc.contributor.department | Center for Nanoscience and Technology | en_US |
dc.identifier.wosnumber | WOS:000280987400009 | en_US |
dc.citation.woscount | 5 | en_US |
顯示於類別: | 期刊論文 |