完整後設資料紀錄
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dc.contributor.authorChiang, M-Hen_US
dc.contributor.authorLiao, K-Cen_US
dc.contributor.authorLin, I-Men_US
dc.contributor.authorLu, C-Cen_US
dc.contributor.authorHuang, H-Yen_US
dc.contributor.authorKuo, C-Len_US
dc.contributor.authorWu, J-Sen_US
dc.contributor.authorHsu, C-Cen_US
dc.contributor.authorChen, S-Hen_US
dc.date.accessioned2019-04-02T05:58:11Z-
dc.date.available2019-04-02T05:58:11Z-
dc.date.issued2010-10-01en_US
dc.identifier.issn0272-4324en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s11090-010-9237-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/150033-
dc.description.abstractEffects of oxygen addition and treating distance on cleaning organic contaminants on stationary and non-stationary (1-9 cm/s) ITO glass surfaces by a parallel-plate nitrogen-based dielectric barrier discharge (DBD) are investigated experimentally; the DBD is driven by a 60 kHz bipolar quasi-pulsed power source. The results show that two regimes of favorable operating condition for improving the hydrophilic property of the surface (reducing the contact angle from 84 degrees to 25-30 degrees) are found. The measured spatial distribution of NO-gamma UV emission, O(3) concentration and OES spectra are shown to strongly correlate with the measured hydrophilic property. At the near jet downstream locations (z < 10 mm), the metastable N(2)(A(3)Sigma(+)(mu)) and photo-induced dissociation of ozone play dominant roles in cleaning the ITO glass surface; while at the far jet downstream locations (z > 10 mm), where the ratio of oxygen to nitrogen is lower, only the long-lived metastable N(2)(A(3)Sigma(+)(mu) ) plays a major role in cleaning the ITO glass surface.en_US
dc.language.isoen_USen_US
dc.subjectAtmospheric-pressure plasma jeten_US
dc.subjectDBDen_US
dc.subjectITOen_US
dc.subjectQuasi-pulseden_US
dc.subjectSurface cleaningen_US
dc.titleEffects of Oxygen Addition and Treating Distance on Surface Cleaning of ITO Glass by a Non-Equilibrium Nitrogen Atmospheric-Pressure Plasma Jeten_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s11090-010-9237-4en_US
dc.identifier.journalPLASMA CHEMISTRY AND PLASMA PROCESSINGen_US
dc.citation.volume30en_US
dc.citation.spage553en_US
dc.citation.epage563en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000281987100002en_US
dc.citation.woscount36en_US
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