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dc.contributor.authorChen, Yu-Tingen_US
dc.contributor.authorChen, Kun-Mingen_US
dc.contributor.authorLin, Cheng-Lien_US
dc.contributor.authorYeh, Wen-Kuanen_US
dc.contributor.authorHuang, Guo-Weien_US
dc.contributor.authorLai, Chien-Mingen_US
dc.contributor.authorChen, Yi-Wenen_US
dc.contributor.authorHsu, Che-Huaen_US
dc.contributor.authorHuang, Fon-Shanen_US
dc.date.accessioned2019-04-02T05:59:53Z-
dc.date.available2019-04-02T05:59:53Z-
dc.date.issued2011-03-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2010.2101606en_US
dc.identifier.urihttp://hdl.handle.net/11536/150253-
dc.description.abstractThe effects of post-NH3 plasma nitridation on device's hot-carrier instability and low-frequency noise in the Hf-based high-kappa/metal-gate n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs) with gadolinium (Gd) cap layers are investigated. With postnitridation, the direct-current and 1/f noise characteristics can be improved apparently. Moreover, a hot-carrier stressing-induced threshold voltage shift can be also suppressed despite of a similar transconductance degradation when comparing with that in the device without nitridation. With the charge-pumping and low-frequency noise measurements, we find that the bulk-and interfacial-trap densities can be reduced with nitrogen incorporation. The reduction of bulk and interfacial traps can be contributed to the suppression of Gd diffusion into a high-kappa layer. In this paper, appropriate post-NH3 plasma nitridation can improve the device performance and reliability and low-frequency noise for a gate-first high-kappa/metal-gate nMOSFET with a Gd cap layer.en_US
dc.language.isoen_USen_US
dc.subjectCharge pumpingen_US
dc.subjectgadolinium (Gd)en_US
dc.subjecthigh-kappaen_US
dc.subjecthot-carrier instability (HCI)en_US
dc.subjectlow-frequency noiseen_US
dc.subjectplasma nitridationen_US
dc.titleEffect of NH3 Plasma Nitridation on Hot-Carrier Instability and Low-Frequency Noise in Gd-Doped High-kappa Dielectric nMOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2010.2101606en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume58en_US
dc.citation.spage812en_US
dc.citation.epage818en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000287665700033en_US
dc.citation.woscount3en_US
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