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dc.contributor.authorChien-Chung Linen_US
dc.contributor.authorHao-Chung Kuoen_US
dc.contributor.authorChin-Wei Sheren_US
dc.contributor.authorHau-Vei Hanen_US
dc.contributor.authorKuo-Ju Chenen_US
dc.contributor.authorZong-Yi Tuen_US
dc.contributor.authorHsien-Hao Tuen_US
dc.date.accessioned2019-04-11T05:42:30Z-
dc.date.available2019-04-11T05:42:30Z-
dc.date.issued2017-02-09en_US
dc.identifier.govdocH01L023/535en_US
dc.identifier.govdocH01L021/768en_US
dc.identifier.govdocH01L023/532en_US
dc.identifier.urihttp://hdl.handle.net/11536/151251-
dc.description.abstractA light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.en_US
dc.language.isoen_USen_US
dc.titlePACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICEen_US
dc.typePatentsen_US
dc.citation.patentcountryUSAen_US
dc.citation.patentnumber20170040262en_US
Appears in Collections:Patents


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