PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chien-Chung Lin	en_US
dc.contributor.author	Hao-Chung Kuo	en_US
dc.contributor.author	Chin-Wei Sher	en_US
dc.contributor.author	Hau-Vei Han	en_US
dc.contributor.author	Kuo-Ju Chen	en_US
dc.contributor.author	Zong-Yi Tu	en_US
dc.contributor.author	Hsien-Hao Tu	en_US
dc.date.accessioned	2019-04-11T05:42:30Z	-
dc.date.available	2019-04-11T05:42:30Z	-
dc.date.issued	2017-02-09	en_US
dc.identifier.govdoc	H01L023/535	en_US
dc.identifier.govdoc	H01L021/768	en_US
dc.identifier.govdoc	H01L023/532	en_US
dc.identifier.uri	http://hdl.handle.net/11536/151251	-
dc.description.abstract	A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.	en_US
dc.language.iso	en_US	en_US
dc.title	PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE	en_US
dc.type	Patents	en_US
dc.citation.patentcountry	USA	en_US
dc.citation.patentnumber	20170040262	en_US
顯示於類別：	專利資料

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