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DC FieldValueLanguage
dc.contributor.authorChi-Chuan WANGen_US
dc.contributor.authorKuo-Wei LINen_US
dc.date.accessioned2019-04-11T05:42:34Z-
dc.date.available2019-04-11T05:42:34Z-
dc.date.issued2017-03-02en_US
dc.identifier.govdocH05K007/20en_US
dc.identifier.urihttp://hdl.handle.net/11536/151256-
dc.description.abstractA heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.en_US
dc.language.isoen_USen_US
dc.titleHEAT CONDUCTING MODULEen_US
dc.typePatentsen_US
dc.citation.patentcountryUSAen_US
dc.citation.patentnumber20170064866en_US
Appears in Collections:Patents


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