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dc.contributor.authorChun-Yen CHANGen_US
dc.contributor.authorChun-Hu CHENGen_US
dc.contributor.authorYu-Pin LANen_US
dc.date.accessioned2019-04-11T05:47:39Z-
dc.date.available2019-04-11T05:47:39Z-
dc.date.issued2017-09-21en_US
dc.identifier.govdocH01L029/40en_US
dc.identifier.govdocH01L029/66en_US
dc.identifier.govdocH01L029/778en_US
dc.identifier.govdocH01L029/423en_US
dc.identifier.govdocH01L029/20en_US
dc.identifier.govdocH01L029/205en_US
dc.identifier.urihttp://hdl.handle.net/11536/151301-
dc.description.abstractA semiconductor device for ultra-high voltage (UHV) operation disclosed in the present invention includes a substrate having a normally-on channel, a negative capacitance material layer, an electrode, a source and a drain. The negative capacitance material layer is disposed over the substrate and capable of adjusting the threshold voltage of the semiconductor device so as to transform the normally-on channel into a normally-off channel and change the transistor characteristics of the semiconductor device from a depletion mode to an enhance mode. In addition, the semiconductor device also includes a gate dielectric layer made of high-k material between the negative capacitance material layer, a gate layer between the gate dielectric layer and the negative capacitance material layer and an ion implantation layer in the substrate under the gate. Furthermore, the aforementioned technical features or structures can be formed in a semiconductor device having a gate-recessed structure.en_US
dc.language.isoen_USen_US
dc.titleSEMICONDUCTOR DEVICE FOR ULTRA-HIGH VOLTAGE OPERATION AND METHOD FOR FORMING THE SAMEen_US
dc.typePatentsen_US
dc.citation.patentcountryUSAen_US
dc.citation.patentnumber20170271460en_US
Appears in Collections:Patents


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