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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorCheng, Hui-Wenen_US
dc.contributor.authorChiu, Yung-Yuehen_US
dc.contributor.authorYiu, Chun-Yenen_US
dc.contributor.authorSu, Hsin-Wenen_US
dc.date.accessioned2014-12-08T15:21:19Z-
dc.date.available2014-12-08T15:21:19Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-4577-0505-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/15145-
dc.description.abstractIn this work, we for the first time estimate total fluctuation resulting from random dopants (RDs), interface trap (ITs) and work functions (WKs) using experimentally calibrated 3D device simulation on 16-nm-gate high-kappa/metal gate devices. The total 3D simulated threshold voltage fluctuation (sigma V-th), induced by the aforementioned random sources simultaneously, is 55.5 mV for NMOS; however, a statistical total sum of these fluctuations is 12.3% overestimation because independence assumption on random variables is invalid owing to strong interactions among RDs, ITs and WKs. Device's DC/AC and CMOS SRAM circuit fluctuations have similar observation. FinFET-based structure innovation possessing large fluctuation suppression (sigma V-th = 30.2 mV; 45.6% reduction), compared with process efforts on planar one, is further discussed.en_US
dc.language.isoen_USen_US
dc.titleA Unified 3D Device Simulation of Random Dopant, Interface Trap and Work Function Fluctuations on High-kappa/Metal Gate Deviceen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000300015300027-
Appears in Collections:Conferences Paper