Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lin, Wei-Liang | en_US |
dc.contributor.author | Tsai, Wen-Jer | en_US |
dc.contributor.author | Cheng, C. C. | en_US |
dc.contributor.author | Ku, S. H. | en_US |
dc.contributor.author | Liu, Lenvis | en_US |
dc.contributor.author | Hwang, S. W. | en_US |
dc.contributor.author | Lu, Tao-Cheng | en_US |
dc.contributor.author | Chen, Kuang-Chao | en_US |
dc.contributor.author | Tseng, Tseung-Yuen | en_US |
dc.contributor.author | Lu, Chih-Yuan | en_US |
dc.date.accessioned | 2019-05-02T00:25:50Z | - |
dc.date.available | 2019-05-02T00:25:50Z | - |
dc.date.issued | 2019-04-01 | en_US |
dc.identifier.issn | 0018-9383 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TED.2019.2900736 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/151585 | - |
dc.description.abstract | Transient cell current caused by the trapping/detrapping of grain boundary traps in the polycrystalline silicon (poly-Si) channel of a 3-D NAND cell string is comprehensively studied in this paper. This transient has a time constant of 10 mu s or longer and is strongly dependent on the bias history. It is also affected by the trap distribution as revealed by TCAD simulations. Sensing offset between program verify and read results in "pseudo" charge loss/gain that reduces the sensing margin. The posttreatment of the poly-Si channel is suggested to mitigate this effect. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | 3-D NAND flash | en_US |
dc.subject | cell current/threshold voltage instability | en_US |
dc.subject | gate-all-around (GAA) | en_US |
dc.subject | grain boundary trap (GBT) | en_US |
dc.subject | nonvolatile memory | en_US |
dc.subject | polycrystalline silicon channel | en_US |
dc.subject | program verify (PV) | en_US |
dc.subject | transient | en_US |
dc.subject | trapping/detrapping | en_US |
dc.title | Grain Boundary Trap-Induced Current Transient in a 3-D NAND Flash Cell String | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TED.2019.2900736 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | en_US |
dc.citation.volume | 66 | en_US |
dc.citation.issue | 4 | en_US |
dc.citation.spage | 1734 | en_US |
dc.citation.epage | 1740 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000461838600018 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Articles |