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dc.contributor.authorHsieh, E. R.en_US
dc.contributor.authorChung, Steve S.en_US
dc.contributor.authorLiu, P. W.en_US
dc.contributor.authorChiang, W. T.en_US
dc.contributor.authorTsai, C. H.en_US
dc.contributor.authorTeng, W. Y.en_US
dc.contributor.authorLi, C. I.en_US
dc.contributor.authorKuo, T. F.en_US
dc.contributor.authorWang, Y. R.en_US
dc.contributor.authorYang, C. L.en_US
dc.contributor.authorTsai, C. T.en_US
dc.contributor.authorMa, G. H.en_US
dc.date.accessioned2014-12-08T15:21:21Z-
dc.date.available2014-12-08T15:21:21Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-5639-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/15171-
dc.description.abstractA new yet simple approach, V(D,sat) method, without complicate temperature measurement setup, has been developed to investigate the carrier transport characteristics for MOSFET devices in the quasi-ballistic regime. It has shown quite good matches with that of Temperature Dependent Method (TDM) developed from the quantum theory [1]. For the first time, the carrier transport properties after HC stress were also examined based on the proposed method. Moreover, method has been applied to examine the carrier transport and reliabilities in advanced strain-CMOS devices. In terms of the device performance, the enhancement of the drain current is strongly related to the transport parameter, the injection velocity, V(inj) which serves as a good monitor for the strain design and current enhancement. While, considering the device reliability after the HC stress, ballistic efficiency, B(sat) is responsible for the I(D) degradation as a result of the increase in interface scatterings. Finally, a roadmap of the V(inj) from those reported results has been provided which serves as a good reference for designing high performance strain-based CMOS devices.en_US
dc.language.isoen_USen_US
dc.titleA New and Simple Experimental Approach to Characterizing the Carrier Transport and Reliability of Strained CMOS Devices in the Quasi-Ballistic Regimeen_US
dc.typeArticleen_US
dc.identifier.journal2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETINGen_US
dc.citation.spage729en_US
dc.citation.epage732en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000279343900188-
Appears in Collections:Conferences Paper