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dc.contributor.authorHuang, Che-Hsuanen_US
dc.contributor.authorKang, Chieh-Yuen_US
dc.contributor.authorChang, Shu-Hsiuen_US
dc.contributor.authorLin, Chih-Haoen_US
dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorWu, Tingzhuen_US
dc.contributor.authorSher, Chin-Weien_US
dc.contributor.authorLin, Chien-Chungen_US
dc.contributor.authorLee, Po-Tsungen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.date.accessioned2019-06-03T01:08:36Z-
dc.date.available2019-06-03T01:08:36Z-
dc.date.issued2019-04-01en_US
dc.identifier.issn2073-4352en_US
dc.identifier.urihttp://dx.doi.org/10.3390/cryst9040202en_US
dc.identifier.urihttp://hdl.handle.net/11536/151966-
dc.description.abstractIn this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.en_US
dc.language.isoen_USen_US
dc.subjectchip scale packageen_US
dc.subjectfreeform designen_US
dc.subjectmini LEDen_US
dc.subjectlight emitting diodeen_US
dc.titleUltra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Arrayen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/cryst9040202en_US
dc.identifier.journalCRYSTALSen_US
dc.citation.volume9en_US
dc.citation.issue4en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department光電系統研究所zh_TW
dc.contributor.department電機學院zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentInstitute of Photonic Systemen_US
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000467300100022en_US
dc.citation.woscount0en_US
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