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dc.contributor.authorWu, Ming-Hungen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorLi, Pei-Wenen_US
dc.date.accessioned2019-06-03T01:08:38Z-
dc.date.available2019-06-03T01:08:38Z-
dc.date.issued2019-06-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/1347-4065/ab1ba8en_US
dc.identifier.urihttp://hdl.handle.net/11536/151991-
dc.description.abstractWe report the design and fabrication of ZnO thin-film transistors (TFTs) configured with designed gate-to-drain (G/D)-offset structures and an auxiliary gate (AG) in a film-profile engineering (FPE) approach for back-end-of-line high-voltage (HV) operation. The breakdown voltage (V-BD) of fabricated FPE TFTs is significantly enhanced from 23 to 90 V by changing the G/D-offset length from -0.3 to 0.5 mu m, whereas there is a corresponding decrease in the on-state current and transconductance (G(m)). To boost the on-state current, an AG biased in the range of 0-5 V is designed to effectively modulate the resistivity of the G/D-offset region and improve G(m) by a factor of 2 while keeping V-BD of 65-70 V nearly unchanged. Output characteristics with drain voltage as high as 60 V have been demonstrated, evidencing the promising potential of the ZnO TFTs for HV device applications. (C) 2019 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleFilm-profile-engineered ZnO thin-film transistor with gate/drain offset for high-voltage operationen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/1347-4065/ab1ba8en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume58en_US
dc.citation.issue6en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000467830500001en_US
dc.citation.woscount0en_US
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