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dc.contributor.authorLee, RGHen_US
dc.contributor.authorSu, JSen_US
dc.contributor.authorChung, SSen_US
dc.date.accessioned2014-12-08T15:02:55Z-
dc.date.available2014-12-08T15:02:55Z-
dc.date.issued1996-01-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.477596en_US
dc.identifier.urihttp://hdl.handle.net/11536/1521-
dc.description.abstractPrevious studies showed that simultaneous determination of the interface states (N-it) and oxide-trapped charges (Q(ox)) in the vicinity of the drain side in MOS devices was rather difficult, A new technique which allows a consistent characterization of the spatial distributions of both hot-carrier-induced N-it and Q(ox) is presented, Submicron LDD n-MOS devices were tested and charge pumping measurements were performed, The spatial distributions of both N-it and Q(ox) have been justified by two-dimensional (2-D) device simulation of the I-V characteristics for devices before and after the stress. Comparison of the drain current characteristics between simulation and experiment shows very good agreement. Moreover, results show that fixed-oxide charge effect is less pronounced to the device degradation for devices.en_US
dc.language.isoen_USen_US
dc.titleA new method for characterizing the spatial distributions of interface states and oxide-trapped charges in LDD n-MOSFET'sen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.477596en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume43en_US
dc.citation.issue1en_US
dc.citation.spage81en_US
dc.citation.epage89en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996TN38600012-
dc.citation.woscount29-
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