完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lee, RGH | en_US |
dc.contributor.author | Su, JS | en_US |
dc.contributor.author | Chung, SS | en_US |
dc.date.accessioned | 2014-12-08T15:02:55Z | - |
dc.date.available | 2014-12-08T15:02:55Z | - |
dc.date.issued | 1996-01-01 | en_US |
dc.identifier.issn | 0018-9383 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/16.477596 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/1521 | - |
dc.description.abstract | Previous studies showed that simultaneous determination of the interface states (N-it) and oxide-trapped charges (Q(ox)) in the vicinity of the drain side in MOS devices was rather difficult, A new technique which allows a consistent characterization of the spatial distributions of both hot-carrier-induced N-it and Q(ox) is presented, Submicron LDD n-MOS devices were tested and charge pumping measurements were performed, The spatial distributions of both N-it and Q(ox) have been justified by two-dimensional (2-D) device simulation of the I-V characteristics for devices before and after the stress. Comparison of the drain current characteristics between simulation and experiment shows very good agreement. Moreover, results show that fixed-oxide charge effect is less pronounced to the device degradation for devices. | en_US |
dc.language.iso | en_US | en_US |
dc.title | A new method for characterizing the spatial distributions of interface states and oxide-trapped charges in LDD n-MOSFET's | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/16.477596 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | en_US |
dc.citation.volume | 43 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.spage | 81 | en_US |
dc.citation.epage | 89 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:A1996TN38600012 | - |
dc.citation.woscount | 29 | - |
顯示於類別: | 期刊論文 |