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dc.contributor.authorYao, Jing Nengen_US
dc.contributor.authorLin, Yueh Chinen_US
dc.contributor.authorLin, Min Songen_US
dc.contributor.authorHuang, Ting Juien_US
dc.contributor.authorHsu, Heng Tungen_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.authorChang, Edward Y.en_US
dc.date.accessioned2019-08-02T02:18:36Z-
dc.date.available2019-08-02T02:18:36Z-
dc.date.issued2019-07-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.sse.2019.03.060en_US
dc.identifier.urihttp://hdl.handle.net/11536/152401-
dc.description.abstractIn this study, we have presented a source-connected field plate (SCFP) InAs high electron mobility transistor (HEMT) and evaluated its potential for using in high-speed and low-power logic applications. The fabricated device demonstrated good electrical characteristics including low subthreshold swing (SS) of 76 mV/decade, drain induced barrier lowering (DIBL) of 44 mV/V, I-ON/I-OFF ratio of 2.4x10(4), an off-state gate leakage current of less than 5x10(-6) A/mm and a G(m,max) of 1100 mS/mm at V-DS = 0.5 V. When increasing the drain-source bias (V-DS) to 1.0 V, the G(m,max) increased to 1750 mS/mm with a cut-off frequency of 113 GHz. These results revealed that the fabrication of source-connected field plate InAs HEMTs achieved excellent device performance for high-speed and low-power logic applications.en_US
dc.language.isoen_USen_US
dc.subjectInAsen_US
dc.subjectField plateen_US
dc.subjectLow poweren_US
dc.subjectHEMTen_US
dc.titleEvaluation of an InAs HEMT with source-connected field plate for high-speed and low-power logic applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.sse.2019.03.060en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume157en_US
dc.citation.spage55en_US
dc.citation.epage60en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department國際半導體學院zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInternational College of Semiconductor Technologyen_US
dc.identifier.wosnumberWOS:000469851100008en_US
dc.citation.woscount0en_US
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