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dc.contributor.authorLo, Wen-Shengen_US
dc.contributor.authorChiou, Hong-Wenen_US
dc.contributor.authorHsu, Shih-Chiehen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.authorCheng, Liang-Chiaen_US
dc.date.accessioned2019-10-05T00:09:47Z-
dc.date.available2019-10-05T00:09:47Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-7281-2461-2en_US
dc.identifier.issn1936-3958en_US
dc.identifier.urihttp://hdl.handle.net/11536/152970-
dc.description.abstractThis work utilizes machine learning techniques to achieve learning based mesh generation for the thermal simulator. In the learning stage, first, we generate many power value sets of application processors and apply the superposition technique to obtain the temperature raw data of material blocks. We, then, use these thermal data and several defined thermal gradient ranges to obtain different appropriate mesh-size sets of material blocks for each power value set. We construct the regressions that are capable of predicting targets as a supervised learning task, and the architecture of regression model includes seven hidden layers. After the learning stage, we integrate the learning based mesh decision engine into a developed system-level thermal simulator, which is built by the finite difference method. The experimental results show that the temperature profiles of the handheld device calculated by the developed thermal simulator with learning based mesh generation fits the results obtained by a commercial tool pretty well with less runtime usages. Moreover, the learning based mesh decision engine is much more efficient than the artificial mesh decision.en_US
dc.language.isoen_USen_US
dc.subjectadaptive meshingen_US
dc.subjectheat transfer equationen_US
dc.subjectmachine learningen_US
dc.subjectfinite difference method (FDM)en_US
dc.subjectthermal gradienten_US
dc.subjectcircuit simulationen_US
dc.titleLearning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power Consumptionen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019)en_US
dc.citation.spage7en_US
dc.citation.epage12en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000484930800003en_US
dc.citation.woscount0en_US
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