完整後設資料紀錄
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dc.contributor.authorShen, Hanen_US
dc.contributor.authorXie, Gongnanen_US
dc.contributor.authorWang, Chi-Chuanen_US
dc.date.accessioned2019-12-13T01:09:59Z-
dc.date.available2019-12-13T01:09:59Z-
dc.date.issued2019-11-01en_US
dc.identifier.issn1290-0729en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ijthermalsci.2019.105975en_US
dc.identifier.urihttp://hdl.handle.net/11536/153061-
dc.description.abstractThe study examined the performance of a novel staggered flow alternation structure in the Double-layer Microchannel Heat Sink (DMHS) based on authors' prior work and further detailed and quantitatively influences regarding the effects of the numbers of multiple staggered flow alternation structures are thoroughly investigated. Yet the analysis also contains more in-depth description about the entropy generation caused by heat transfer and liquid flow based on the second-law perspective. The major influential factors combining thermal performance and pressure drop penalty such as Nusselt number, Reynolds number, pumping power and thermal performance factor have been numerically studied. Moreover, the flow directions with parallel/counter stream were also compared in the present work. Through these detailed analysis, the propose multiple novel design offers much superior performance with better thermal uniformity and augment entropy generation number. The results show that the temperature difference of the substrate can be made quite uniformly by adding the number of multiple staggered flow alternation structure, and superior performance of the proposed DMHS can be achieved with affordable pressure drop penalty, while the DMHS with single alternation structure shows higher thermal performance.en_US
dc.language.isoen_USen_US
dc.subjectDouble-layer microchannel heat sinksen_US
dc.subjectMultiple flow alternationsen_US
dc.subjectEntropy generation rateen_US
dc.subjectThermal resistanceen_US
dc.subjectPressure dropen_US
dc.titleHeat transfer and thermodynamic analysis by introducing multiple alternation structures into double-layer microchannel heat sinksen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.ijthermalsci.2019.105975en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF THERMAL SCIENCESen_US
dc.citation.volume145en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000487647600009en_US
dc.citation.woscount0en_US
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