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dc.contributor.authorHorng, Ray-Huaen_US
dc.contributor.authorLai, Yan-Chungen_US
dc.contributor.authorLai, Liang-Hsingen_US
dc.date.accessioned2019-12-13T01:10:04Z-
dc.date.available2019-12-13T01:10:04Z-
dc.date.issued2019-10-09en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0162001JSSen_US
dc.identifier.urihttp://hdl.handle.net/11536/153133-
dc.description.abstractIn this study, deep-ultraviolet 280-nm-wavelength light-emitting diodes (DUVLEDs) with a nanopatterned sapphire substrate (NPSS) were fabricated using a nanoimprint lithography process. The output power of these flip-chip (FC) DUV LEDs was measured and analyzed in a ray-tracing simulation using NPSSs: cones with diameters of 2.5 mu m (LED1), 400 (LED2) and 200 nm (LED3) as well as holes with diameters of 350 (LED4) and 750 nm (LED5). For comparison, a mirror for the c-plane FC DUV LEDs was introduced by coating Ni/Au and Al thin films. With the injection current at 350 mA, the output powers of the c-plane, LED1, LED2, LED3, LED4, and LED5 were 13.38, 14.68, 20.05, 16.79, 15.74, and 18.93 mW, respectively. The LED2 efficiency improved 49.9% compared with mirror LED and the result was consistent with ray-tracing simulation. (C) The Author(s) 2019. Published by ECS.en_US
dc.language.isoen_USen_US
dc.titleDeep-Ultraviolet LEDs Fabricated by Nanoimprintingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0162001JSSen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.volume9en_US
dc.citation.issue1en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000489558400002en_US
dc.citation.woscount0en_US
Appears in Collections:Articles