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dc.contributor.authorYang, Kai-Mingen_US
dc.contributor.authorChou, Tzu-Chiehen_US
dc.contributor.authorKo, Cheng-Taen_US
dc.contributor.authorLin, Chen-Haoen_US
dc.contributor.authorChen, Yu-Huaen_US
dc.contributor.authorTseng, Tzyy-Jangen_US
dc.contributor.authorWu, Wen-Weien_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2019-12-13T01:12:49Z-
dc.date.available2019-12-13T01:12:49Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-4-904743-07-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/153257-
dc.description.abstractIn this paper, low temperature (190-220 degrees C) Cu-Cu gang bonding at a low vacuum pressure is demonstrated. The low temperature technologies can be applied to the RDL-first Fan-Out panel level package (FOPLP).en_US
dc.language.isoen_USen_US
dc.titleLow Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Packageen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)en_US
dc.citation.spage10en_US
dc.citation.epage10en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000492018300010en_US
dc.citation.woscount0en_US
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