标题: Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films
作者: Chen, Fu-Chian
Wu, Yu-Ting
Chen, Chih
材料科学与工程学系
Department of Materials Science and Engineering
公开日期: 1-一月-2019
摘要: In this study, we capped gold on the surface of highly (111)-orientated nano-twin copper films. With the great diffusivity of (111) copper and the low activity in gold, we can achieve a lower bonding temperature.
URI: http://hdl.handle.net/11536/153260
ISBN: 978-4-904743-07-2
期刊: PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)
起始页: 51
结束页: 51
显示于类别:Conferences Paper