完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChu, Wenxiaoen_US
dc.contributor.authorWang, Chi-Chuanen_US
dc.date.accessioned2020-01-02T00:04:20Z-
dc.date.available2020-01-02T00:04:20Z-
dc.date.issued2019-11-01en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2019.2916017en_US
dc.identifier.urihttp://hdl.handle.net/11536/153386-
dc.description.abstractIn this paper, the cooling performance of a small container data center is numerically investigated. It is indicated that adjusting the plenum depth and placing baffles in the plenum can improve the airflow uniformity efficiently. On the other hand, the perforated tiles with low porosity of 25 also can significantly improve the air flowrate distribution by 88.9 with the severe pumping power penalty of 2.79 times. Hence, the layout of perforated tiles with nonuniform porosities is optimized with the fixed average porosity of 50, which can obtain almost absolutely uniform flowrate distribution in the cold aisle. In addition, the cold aisle containment (CAC) strategy is implemented, resulting in the improved rack cooling index (RCI) and supply heat index (SHI) to approach to 100 and 0, respectively. However, the intake flowrates still suffer from nonuniformity due to the bypass effect, thus a novel criterion named flowrate uniformity index (FUI) is proposed. Besides, the drawer-type layouts with the shifting distance ( $\delta$ ) varying from 0 to 200 mm are investigated, and the case with $\delta = 150$ mm shows the best improvement in terms of the standard deviation of FUI ( $\sigma _{\mathrm {FUI}}$ ). Moreover, the $\sigma _{\mathrm {FUI}}$ of the case with a three-layer drawer-type layout can be further improved by 45.8.en_US
dc.language.isoen_USen_US
dc.subjectAirflow managementen_US
dc.subjectcontainer data centeren_US
dc.subjectnonuniform perforated tilesen_US
dc.subjectrack flow uniformity indexen_US
dc.titleCFD Investigation of Airflow Management in a Small Container Data Centeren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCPMT.2019.2916017en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume9en_US
dc.citation.issue11en_US
dc.citation.spage2177en_US
dc.citation.epage2188en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000497778500005en_US
dc.citation.woscount0en_US
顯示於類別:期刊論文