完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLo, Ching-Wenen_US
dc.contributor.authorChu, Yu-Chengen_US
dc.contributor.authorYen, Ming-Hanen_US
dc.contributor.authorLu, Ming-Changen_US
dc.date.accessioned2020-01-02T00:04:21Z-
dc.date.available2020-01-02T00:04:21Z-
dc.date.issued2019-11-20en_US
dc.identifier.issn2542-4351en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.joule.2019.08.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/153391-
dc.description.abstractIn recent years, micro/nanostructured surfaces have been applied to enhance condensation heat transfer. However, condensation heat transfer is greatly deteriorated by the flooding phenomenon that occurs at high subcooling temperatures. Here, we propose a three-dimensional (3D) hybrid surface to enhance the condensation at high subcooling temperatures. The 3D hybrid surface consisted of superhydrophobic (SHB) Si nanowire (SiNW) arrays and hydrophilic microchannels. The microchannels could confine the liquid-film thickness, and the liquid bridges formed on the 3D hybrid surfaces could be self-removed. Both of these characteristics prevent the surfaces from flooding. In addition, liquid droplets formed in the SiNW regions were dragged into the microchannels, which also improved the heat transfer. The heat transfer coefficient on the 3D hybrid surface could be enhanced over a large subcooling range. More remarkably, a record high heat flux of 655 +/- 10 kW.m(-2) was obtained on the 3D hybrid surface.en_US
dc.language.isoen_USen_US
dc.titleEnhancing Condensation Heat Transfer on Three-Dimensional Hybrid Surfacesen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.joule.2019.08.005en_US
dc.identifier.journalJOULEen_US
dc.citation.volume3en_US
dc.citation.issue11en_US
dc.citation.spage2806en_US
dc.citation.epage2823en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000497987900021en_US
dc.citation.woscount0en_US
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