Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

doi:10.1109/MDAT.2019.2932935

Full metadata record

DC Field	Value	Language
dc.contributor.author	Cheng, Shu-Feng	en_US
dc.contributor.author	Huang, Po-Tsang	en_US
dc.contributor.author	Wang, Li-Chun	en_US
dc.contributor.author	Chang, Mau-Chung Frank	en_US
dc.date.accessioned	2020-01-02T00:04:24Z	-
dc.date.available	2020-01-02T00:04:24Z	-
dc.date.issued	2019-12-01	en_US
dc.identifier.issn	2168-2356	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/MDAT.2019.2932935	en_US
dc.identifier.uri	http://hdl.handle.net/11536/153438	-
dc.description.abstract	Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University	en_US
dc.language.iso	en_US	en_US
dc.subject	Through-silicon vias	en_US
dc.subject	Built-in self-test	en_US
dc.subject	Maintenance engineering	en_US
dc.subject	Three-dimensional displays	en_US
dc.subject	Circuit faults	en_US
dc.subject	Bandwidth	en_US
dc.subject	Frequency division multiplexing	en_US
dc.subject	multiband RF-Interconnect	en_US
dc.subject	test methodology	en_US
dc.subject	TSV density	en_US
dc.subject	yield improvement	en_US
dc.subject	PRBS	en_US
dc.subject	phase error	en_US
dc.subject	BIST	en_US
dc.subject	R	en_US
dc.subject	e-fuse	en_US
dc.title	Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/MDAT.2019.2932935	en_US
dc.identifier.journal	IEEE DESIGN & TEST	en_US
dc.citation.volume	36	en_US
dc.citation.issue	6	en_US
dc.citation.spage	63	en_US
dc.citation.epage	71	en_US
dc.contributor.department	交大名義發表	zh_TW
dc.contributor.department	電機資訊學士班	zh_TW
dc.contributor.department	電機工程學系	zh_TW
dc.contributor.department	國際半導體學院	zh_TW
dc.contributor.department	National Chiao Tung University	en_US
dc.contributor.department	Undergraduate Honors Program of Electrical Engineering and Computer Science	en_US
dc.contributor.department	Department of Electrical and Computer Engineering	en_US
dc.contributor.department	International College of Semiconductor Technology	en_US
dc.identifier.wosnumber	WOS:000499992900007	en_US
dc.citation.woscount	0	en_US
Appears in Collections:	Articles