完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, Chih-Yang | en_US |
dc.contributor.author | Chang, Ting-Chang | en_US |
dc.contributor.author | Pan, Chih-Hung | en_US |
dc.contributor.author | Chen, Min-Chen | en_US |
dc.contributor.author | Xu, You-Lin | en_US |
dc.contributor.author | Tan, Yung-Fang | en_US |
dc.contributor.author | Wu, Pei-Yu | en_US |
dc.contributor.author | Chen, Chun-Kuei | en_US |
dc.contributor.author | Huang, Wei-Chen | en_US |
dc.contributor.author | Lin, Yun-Hsuan | en_US |
dc.contributor.author | Chao, Yu-Ting | en_US |
dc.contributor.author | Shou, Cheng-Yun | en_US |
dc.contributor.author | Ma, Xiao-Hua | en_US |
dc.contributor.author | Hao, Yue | en_US |
dc.contributor.author | Sze, Simon M. | en_US |
dc.date.accessioned | 2020-02-02T23:54:28Z | - |
dc.date.available | 2020-02-02T23:54:28Z | - |
dc.date.issued | 2020-03-15 | en_US |
dc.identifier.issn | 0925-8388 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.jallcom.2019.05.034 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/153496 | - |
dc.description.abstract | A technique was proposed to concentrate the distribution of set voltages. After a plasma treatment, the stability of the high-resistive state (HRS) increased, and the distribution of set voltages was more concentrated at 0.8 V, with a sufficient HRS/LRS resistive ratio (similar to 100x). In addition, the surface of the TiN electrode became rougher, causing oxygen to enter the TiN electrode and form a TiON layer, which acts as an oxygen reservoir. The reservoir is confirmed and the conduction model is supported by both electrical and material analyses. We propose that the observed improvement is due to the difference in the TiN electrode surface. (C) 2019 Published by Elsevier B.V. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | RRAM | en_US |
dc.subject | Plasma treatment | en_US |
dc.subject | TiN electrode | en_US |
dc.subject | Resistive switching | en_US |
dc.title | A characteristic improved technique and analysis with plasma treatment to the electrode on oxide-based resistive random access memory | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.jallcom.2019.05.034 | en_US |
dc.identifier.journal | JOURNAL OF ALLOYS AND COMPOUNDS | en_US |
dc.citation.volume | 817 | en_US |
dc.citation.spage | 0 | en_US |
dc.citation.epage | 0 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000506166400001 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 期刊論文 |