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dc.contributor.authorChang, Yao-Fengen_US
dc.contributor.authorFeng, Li-Weien_US
dc.contributor.authorChang, Ting-Changen_US
dc.date.accessioned2014-12-08T15:21:36Z-
dc.date.available2014-12-08T15:21:36Z-
dc.date.issued2011-12-15en_US
dc.identifier.issn0254-0584en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.matchemphys.2011.09.037en_US
dc.identifier.urihttp://hdl.handle.net/11536/15357-
dc.description.abstractWe investigated annealing effects on the bipolar resistive switching characteristics and mechanism of the thin FeO(x) transition layer in a Ti/TiN/SiO(2)/FeO(x)/FePt structure by depositing a plasma-enhanced tetraethyl orthosilicate oxide onto the Fe-contented electrode. The electrical results show that the values of operation voltage, variation of electrical parameters and retention properties could be improved with the increasing thermal treatment budget. Tunneling electron microscope, X-ray diffraction, Auger electron spectroscopy and X-ray photon-emission spectra depth profiles were examined for cross-section image, crystallinity and composition analyses of the transition layer. In order to investigate the resistive switching mechanism and characterizations in Ti/TiN/SiO(2)/FeO(x)/FePt structure, the electrical parameters were extracted during set and reset process. The retention property at room temperature and 85 C was improved after the thermal treatment and maintains both resistance states over 6 x 10(4) s implies promising potential for future memory application. (C) 2011 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleMechanism and characterizations studies of resistive switching effects on a thin FeO(x)-transition layer of the Ti/TiN/SiO(2)/FeO(x)/FePt structure by thermal annealing treatmentsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.matchemphys.2011.09.037en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.citation.volume131en_US
dc.citation.issue1-2en_US
dc.citation.spage262en_US
dc.citation.epage267en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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