標題: | Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices |
作者: | Hsiao, Hsuan-Hsuan Chiou, Hong-Wen Lee, Yu-Min 交大名義發表 電信工程研究所 National Chiao Tung University Institute of Communications Engineering |
公開日期: | 1-一月-2019 |
摘要: | Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones. |
URI: | http://dx.doi.org/10.1145/3287624.3287666 http://hdl.handle.net/11536/153675 |
ISBN: | 978-1-4503-6007-4 |
DOI: | 10.1145/3287624.3287666 |
期刊: | 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019) |
起始頁: | 70 |
結束頁: | 75 |
顯示於類別: | 會議論文 |