標題: Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
作者: Hsiao, Hsuan-Hsuan
Chiou, Hong-Wen
Lee, Yu-Min
交大名義發表
電信工程研究所
National Chiao Tung University
Institute of Communications Engineering
公開日期: 1-一月-2019
摘要: Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.
URI: http://dx.doi.org/10.1145/3287624.3287666
http://hdl.handle.net/11536/153675
ISBN: 978-1-4503-6007-4
DOI: 10.1145/3287624.3287666
期刊: 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019)
起始頁: 70
結束頁: 75
顯示於類別:會議論文