Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hsiao, Hsuan-Hsuan | en_US |
dc.contributor.author | Chiou, Hong-Wen | en_US |
dc.contributor.author | Lee, Yu-Min | en_US |
dc.date.accessioned | 2020-02-02T23:55:34Z | - |
dc.date.available | 2020-02-02T23:55:34Z | - |
dc.date.issued | 2019-01-01 | en_US |
dc.identifier.isbn | 978-1-4503-6007-4 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1145/3287624.3287666 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/153675 | - |
dc.description.abstract | Heat pipe is an effective passive cooling technique for mobile devices. This work builds a multi-angle bended heat pipe thermal model and presents an X-architecture routing engine guided by developed dynamic thermal weights to construct the heat pipe path for reducing the operating temperatures of a smartphone. Compared with a commercial tool, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.doi | 10.1145/3287624.3287666 | en_US |
dc.identifier.journal | 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019) | en_US |
dc.citation.spage | 70 | en_US |
dc.citation.epage | 75 | en_US |
dc.contributor.department | 交大名義發表 | zh_TW |
dc.contributor.department | 電信工程研究所 | zh_TW |
dc.contributor.department | National Chiao Tung University | en_US |
dc.contributor.department | Institute of Communications Engineering | en_US |
dc.identifier.wosnumber | WOS:000507459700021 | en_US |
dc.citation.woscount | 1 | en_US |
Appears in Collections: | Conferences Paper |