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dc.contributor.authorGusak, A. M.en_US
dc.contributor.authorTu, K. N.en_US
dc.contributor.authorChen, Chihen_US
dc.date.accessioned2020-05-05T00:01:29Z-
dc.date.available2020-05-05T00:01:29Z-
dc.date.issued2020-04-01en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2020.01.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/153916-
dc.description.abstractIn 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 mu m, the scallop-type Cu6Sn5 grains on opposite sides of the joint can interact directly by contacting each other during the solid-liquid interdiffusion reaction. Upon contact, an extremely rapid grain growth of the scallops occurs. We propose that the liquid solder wets the grain boundary between scallops and provides an extremely fast kinetic path of liquid channel for grain growth. The width of the liquid channel has been estimated to be about 1.5 nm. This is a unique phenomenon observed in micro-bump solid joints. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectScallop of Cu6Sn5en_US
dc.subjectGrain growthen_US
dc.subjectMicro-bumpen_US
dc.subjectSolder joint technologyen_US
dc.subjectLiquid channelen_US
dc.titleExtremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder jointsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.scriptamat.2020.01.005en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume179en_US
dc.citation.spage45en_US
dc.citation.epage48en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000514758200010en_US
dc.citation.woscount0en_US
Appears in Collections:Articles


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