標題: Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition
作者: Lu, Tien-Lin
Shen, Yu-An
Wu, John A.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: nanotwinned Cu;grain growth;preferred orientation;electrodeposition;thermal annealing
公開日期: 1-一月-2020
摘要: We have reported a method of fabricating (111)-orientated nanotwinned copper (nt-Cu) by direct current electroplating. X-ray analysis was performed for the samples annealed at 200 to 350 degrees C for an hour. X-ray diffraction indicates that the (200) signal intensity increases while (111) decreases. Abnormal grain growth normally results from transformation of surface energy or strain energy density. The average grain size increased from 3.8 mu m for the as-deposited Cu films to 65-70 mu m after the annealing at 250 degrees C for 1 h. For comparison, no significant grain growth behavior was observed by random Cu film after annealing for an hour. This research shows the potential for its broad electric application in interconnects and three-dimensional integrated circuit (3D IC) packaging.
URI: http://dx.doi.org/10.3390/ma13010134
http://hdl.handle.net/11536/153931
DOI: 10.3390/ma13010134
期刊: MATERIALS
Volume: 13
Issue: 1
起始頁: 0
結束頁: 0
顯示於類別:期刊論文