標題: An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
作者: Lin, Yu-Min
Wu, Sheng-Tsai
Shen, Wen-Wei
Huang, Shin-Yi
Kuo, Tzu-Ying
Lin, Ang-Ying
Chang, Tao-Chih
Chang, Hsiang-Hung
Lee, Shu-Man
Lee, Chia-Hsin
Su, Jay
Liu, Xiao
Wu, Qi
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Fan-out wafer level packaging;FO-WLP;Process development;Finite element method (FEM);reliability test
公開日期: 1-Jan-2018
摘要: Fan-out wafer-level packaging (FOWLP), a new heterogeneous integration technology, is gradually becoming an attractive solution. Compared with conventional 2.5D/3D IC structures, fan-out WLP does not use a costly interposer element and can have a thin, high-density, and low-cost IC packaging. In this study, a novel fan-out WLP with RDL-first method is demonstrated. Finite element method was used to optimize the warpage control of a reconstituted wafer and to identify the material properties and fabrication for the FOWLP. Calculation results were applied in the design of the test vehicle. Reliability testing of each component level was performed with different techniques such as temperature cycling test (TCT), high temperature storage (HTS) and thermal humidity storage test (THST). The demonstration of RDL-first WLP technology without interposer proves that it has excellent potential for heterogeneous integration applications.
URI: http://dx.doi.org/10.1109/ECTC.2018.00060
http://hdl.handle.net/11536/154475
ISBN: 978-1-5386-4998-5
ISSN: 0569-5503
DOI: 10.1109/ECTC.2018.00060
期刊: 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)
起始頁: 349
結束頁: 354
Appears in Collections:Conferences Paper