完整後設資料紀錄
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dc.contributor.authorYuan, Shuo-Huangen_US
dc.contributor.authorYan, Shih-Siangen_US
dc.contributor.authorYao, Yu-Shiuanen_US
dc.contributor.authorWu, Chung-Chengen_US
dc.contributor.authorHorng, Ray-Huaen_US
dc.contributor.authorWuu, Dong-Singen_US
dc.date.accessioned2020-07-01T05:22:04Z-
dc.date.available2020-07-01T05:22:04Z-
dc.date.issued2020-01-01en_US
dc.identifier.issn2168-6734en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JEDS.2020.2967476en_US
dc.identifier.urihttp://hdl.handle.net/11536/154498-
dc.description.abstractA 0.28-inch InGaN-based blue micro-LED display with 256 pixel-per-inch resolution and a pitch of $100 mu m was successfully fabricated in this study. A thick Ti/Al/Ti/Au interconnection metal was deposited on the n-type gallium nitride (n-GaN) region to reduce the interconnection resistance. The micro-LED array with interconnection metal exhibits better electrical property consistency as compared with that of the traditional one. The output power, forward voltage, and external quantum efficiency of micro-LED, which measured under 1-mA current injection with the full lighting mode, are 0.8 mW, 3.0 V, and 10%, respectively. This technique has the potential to integrate InGaN-based LEDs with quantum dots for full-color applications.en_US
dc.language.isoen_USen_US
dc.subjectMicro-LEDen_US
dc.subjectInGaNen_US
dc.subjectdisplayen_US
dc.subjectinterconnectionen_US
dc.subjectexternal quantum efficiencyen_US
dc.titleProcess Integration and Interconnection Design of Passive-Matrix LED Micro-Displays With 256 Pixel-Per-Inch Resolutionen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JEDS.2020.2967476en_US
dc.identifier.journalIEEE JOURNAL OF THE ELECTRON DEVICES SOCIETYen_US
dc.citation.volume8en_US
dc.citation.issue1en_US
dc.citation.spage251en_US
dc.citation.epage255en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000538092700001en_US
dc.citation.woscount0en_US
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