標題: Effect of Reverse Currents during Electroplating on the < 111 >-Oriented and Nanotwinned Columnar Grain Growth of Copper Films
作者: Chen, Kuan-Ju
Wu, John A.
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 3-六月-2020
摘要: Nanotwinned copper (nt-Cu) has been attracting a great deal of attention in the past decades due to its excellent mechanical and electrical properties. In this study, a new approach, periodic-reverse (PR) waveforms, is adopted to electroplate nt-Cu films with highly < 111 >-oriented columnar grain microstructures. We investigate the effect of the reverse current on the microstructures of < 111 >--oriented nt-Cu films and their grain growth behavior. With proper reverse current parameters, we are able to obtain a nt-Cu film with a significantly thin transition layer, low amount of impurities, and low residual stress levels in comparison to a DC electroplated film. It is also discovered that the grain size after annealing of the nt-Cu film is related to its initial columnar grain microstructures, which can be tailored by the reverse current parameter. These results show that PR electroplating provides a promising approach in improving and controlling the microstructures and properties of nt-Cu films.
URI: http://dx.doi.org/10.1021/acs.cgd.0c00142
http://hdl.handle.net/11536/154513
ISSN: 1528-7483
DOI: 10.1021/acs.cgd.0c00142
期刊: CRYSTAL GROWTH & DESIGN
Volume: 20
Issue: 6
起始頁: 3834
結束頁: 3841
顯示於類別:期刊論文