Full metadata record
DC FieldValueLanguage
dc.contributor.authorHsu, Kuo-Yuanen_US
dc.contributor.authorChen, Kuei-Yueen_US
dc.contributor.authorCheng, Ching-Yuanen_US
dc.contributor.authorLee, Jhih-Jhaoen_US
dc.contributor.authorLeu, Jihperngen_US
dc.date.accessioned2014-12-08T15:21:44Z-
dc.date.available2014-12-08T15:21:44Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-4658-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/15476-
dc.description.abstractUnderfill materials, consisting of organic resin and inorganic filler, have been widely employed in flip-chip technology for preventing the failure of solder joints during packaging process. In order to meet the requirements of high frequency device applications, low-dielectric-constant underill is highly desired to alleviate the power consumption issue. However, it is disadvantageous to introduce low-k into organic resin because of its high cost and low volume fraction. Alternative approach is to use highly porous silica filler with appropriate pore sealing prior to mixing with epoxy. In this paper, a siloxane compound, polymerized vinyl-trimethoxysilane (poly-VSQ), was synthesized and applied to an ordered, porous silica structure, SBA-15 to study its effectiveness in pore sealing and interaction with SBA-15 matrix for low-k underfill applications. We have developed a convenient pore sealing treatment using poly-VSQ to achieve a 10.9% reduction (from 3.2 to 2.85) in dielectric constant of underfill material with 15% filler content by fully retaining the high porosity (61%) of SBA15. Moreover, excellent mechanical strength could be maintained as 3.0GPa without any interfacial delamination.en_US
dc.language.isoen_USen_US
dc.titleNovel Pore-sealing of Ordered, Porous Silica, SBA-15 for Low-k Underfill Materialsen_US
dc.typeArticleen_US
dc.identifier.journal2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009)en_US
dc.citation.spage444en_US
dc.citation.epage449en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000289501700095-
Appears in Collections:Conferences Paper