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dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorHuang, Yu-Anen_US
dc.date.accessioned2020-10-05T02:00:30Z-
dc.date.available2020-10-05T02:00:30Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-7281-0735-6en_US
dc.identifier.issn2162-7541en_US
dc.identifier.urihttp://hdl.handle.net/11536/155027-
dc.description.abstractRecently we proposed and developed a unique film profile engineering (FPE) scheme for the fabrication of high-performance sub-micron oxide-semiconductor TFTs. In this scheme, profiles of the three pivotal thin films contained in a device, including gate oxide, oxide-semiconductor channel, and source/drain metal films, can be effectively tailored by selecting proper deposition tools with tunable process conditions. The fabricated IGZO, ZnO, and ZnON devices show decent performance in terms of high on/off current ratio (>10(8)) and steep subthreshold swing (<100 mV/dec). Since the low-temperature and the mature processes involved are highly compatible to the modern IC manufacturing, the fabricated devices can be readily integrated into the back-end-of-line (BEOL) of an advanced chip, making the FPE scheme useful and potential for a number of emerging applications in the more-than-Moore era.en_US
dc.language.isoen_USen_US
dc.titleA Platform with Exquisite Film Profile Engineering in Oxide-Based Thin-Film Transistors for More-than-Moore Applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000541465700060en_US
dc.citation.woscount0en_US
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