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dc.contributor.authorPeng, Ching-Weien_US
dc.contributor.authorCheng, Ming-Weien_US
dc.contributor.authorChen, Guan-Hongen_US
dc.contributor.authorGuo, Pin-Chengen_US
dc.contributor.authorTsai, Jui-Fengen_US
dc.contributor.authorChow, Chi-Waien_US
dc.date.accessioned2020-10-05T02:00:31Z-
dc.date.available2020-10-05T02:00:31Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-943580-70-5en_US
dc.identifier.issn2162-108Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/155051-
dc.description.abstractA design of silicon-photonics (SiPh) based 4 x 4 enhanced-evanescent-coupling mode-division-multiplexing (EEC-MDM) multiplexer/de-multiplexer is proposed. Compared with the traditional MDM, our proposed EEC-MDM can significantly reduce the footprint while archiving similar coupling efficiencies.en_US
dc.language.isoen_USen_US
dc.titleDesign of Silicon Photonics Based Enhanced Evanescent Coupling Mode-Division Multiplexer and De-multiplexer for Footprint Reductionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2019 ASIA COMMUNICATIONS AND PHOTONICS CONFERENCE (ACP)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:000542671100118en_US
dc.citation.woscount0en_US
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