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dc.contributor.authorJian, Sheng-Ruien_US
dc.contributor.authorChen, Hou-Guangen_US
dc.contributor.authorChen, Guo-Juen_US
dc.contributor.authorJang, Jason S. C.en_US
dc.contributor.authorJuang, Jenh-Yihen_US
dc.date.accessioned2014-12-08T15:21:47Z-
dc.date.available2014-12-08T15:21:47Z-
dc.date.issued2012-05-01en_US
dc.identifier.issn1567-1739en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.cap.2011.11.018en_US
dc.identifier.urihttp://hdl.handle.net/11536/15526-
dc.description.abstractThe effects of O-2 partial pressure during RF magnetron sputtering on the structural and nanomechanical properties of a-plane ZnO thin films were investigated by using X-ray diffraction (XRD) and nanoindentation techniques. The XRD and the transmission electron microscopy (TEM) selected area diffraction results indicate that the epitaxial relationship between ZnO thin films and Al2O3 substrates is ZnO (11 (2) over bar0)//Al2O3 (1 (1) over bar 02). The average values of the hardness and Young's modulus of the a-plane ZnO films were found to decrease with increasing oxygen partial pressure. The cross-sectional TEM revealing the localized plastic deformation of ZnO thin films beneath the Berkovich indenter, indicating the prominent role played by the threading dislocations in the film deformation behavior. At higher indentation loadings, the sapphire substrate exhibits extensive deformation with narrow slip bands appearing on {0001} plane. However, no evidence of pressure-induced phase transformation, as well as cracking and/or delamination phenomena at the film-substrate interface was observed. (C) 2011 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjecta-Plane ZnO thin filmen_US
dc.subjectNanoindentationen_US
dc.subjectFocused ion beamen_US
dc.subjectCross-sectional transmission electron microscopyen_US
dc.titleStructural and nanomechanical properties of a-plane ZnO thin films deposited under different oxygen partial pressuresen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.cap.2011.11.018en_US
dc.identifier.journalCURRENT APPLIED PHYSICSen_US
dc.citation.volume12en_US
dc.citation.issue3en_US
dc.citation.spage849en_US
dc.citation.epage853en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000300715000044-
dc.citation.woscount11-
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