完整後設資料紀錄
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dc.contributor.authorLin, Chih-Chihen_US
dc.contributor.authorTai, Mao-Chouen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsao, Yu-Chingen_US
dc.contributor.authorWang, Yu-Xuanen_US
dc.contributor.authorTsai, Yu-Linen_US
dc.contributor.authorTu, Hong-Yien_US
dc.contributor.authorLu, I-Nienen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorHuang, Jen-Weien_US
dc.date.accessioned2020-10-05T02:02:01Z-
dc.date.available2020-10-05T02:02:01Z-
dc.date.issued2020-09-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2020.3011386en_US
dc.identifier.urihttp://hdl.handle.net/11536/155440-
dc.description.abstractIn this work, an abnormal lowering of subthreshold swing (SS) after self-heating stress in a device with thick channel is observed. A model of interface defect shielding is proposed, based on electron trapping at the channel/gate insulator interface. The phenomenon is discussed systematically through the band diagram and extractions of the field effective mobility. Results suggest that a depletion region appears after electron trapping at the front channel, which then prevents the carriers from reaching the interface defects. Therefore, an abnormal superior electrical performance after stress is observed. Finally, a dual gate amorphous InGaZnO (a-IGZO) thin film transistor (TFT) is used to clarify the phenomenon. Results from different top gate bias voltage confirms the bulk accumulation and better gate control.en_US
dc.language.isoen_USen_US
dc.subjectStressen_US
dc.subjectLogic gatesen_US
dc.subjectThin film transistorsen_US
dc.subjectThreshold voltageen_US
dc.subjectReliabilityen_US
dc.subjectMathematical modelen_US
dc.subjectAmorphous InGaZnO (a-IGZO)en_US
dc.subjectchannel thicknessen_US
dc.subjectcharge trappingen_US
dc.subjectinterface defectsen_US
dc.titleInterface Defect Shielding of Electron Trapping in a-InGaZnO Thin Film Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2020.3011386en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume67en_US
dc.citation.issue9en_US
dc.citation.spage3645en_US
dc.citation.epage3649en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000562091800021en_US
dc.citation.woscount0en_US
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