標題: Effect of Thermal Management on the Performance of VCSELs
作者: Pan, Po-Chou
Nag, Dhiman
Khan, Zuhaib
Chen, Ching-Jung
Shi, Jin-Wei
Laha, Apurba
Horng, Ray-Hua
交大名義發表
電子工程學系及電子研究所
National Chiao Tung University
Department of Electronics Engineering and Institute of Electronics
關鍵字: COMSOL simulations;heat dissipation;thermal management;vertical-cavity surface-emitting lasers (VCSELs)
公開日期: 1-九月-2020
摘要: This study investigated the effect of thermal management on the performance of vertical-cavity surface-emitting lasers (VCSELs). It was found that the thickness of silicon substrate, which can serve as the submount for VCSEL packages, has a strong influence on the thermal dissipation of on-chip laser sources, and eventually impacts on their output characteristics. Moreover, the improvements in optical characteristics of the on-chip VCSELs were the best heat dissipation through thinning silicon substrates to 50-mu m thickness combined with electroplated Cu with 100-mu m thickness. In addition, this study also performed COMSOL simulations. The simulation results were consistent with experimental results.
URI: http://dx.doi.org/10.1109/TED.2020.3007724
http://hdl.handle.net/11536/155442
ISSN: 0018-9383
DOI: 10.1109/TED.2020.3007724
期刊: IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume: 67
Issue: 9
起始頁: 3736
結束頁: 3739
顯示於類別:期刊論文