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dc.contributor.authorPan, Po-Chouen_US
dc.contributor.authorNag, Dhimanen_US
dc.contributor.authorKhan, Zuhaiben_US
dc.contributor.authorChen, Ching-Jungen_US
dc.contributor.authorShi, Jin-Weien_US
dc.contributor.authorLaha, Apurbaen_US
dc.contributor.authorHorng, Ray-Huaen_US
dc.date.accessioned2020-10-05T02:02:01Z-
dc.date.available2020-10-05T02:02:01Z-
dc.date.issued2020-09-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2020.3007724en_US
dc.identifier.urihttp://hdl.handle.net/11536/155442-
dc.description.abstractThis study investigated the effect of thermal management on the performance of vertical-cavity surface-emitting lasers (VCSELs). It was found that the thickness of silicon substrate, which can serve as the submount for VCSEL packages, has a strong influence on the thermal dissipation of on-chip laser sources, and eventually impacts on their output characteristics. Moreover, the improvements in optical characteristics of the on-chip VCSELs were the best heat dissipation through thinning silicon substrates to 50-mu m thickness combined with electroplated Cu with 100-mu m thickness. In addition, this study also performed COMSOL simulations. The simulation results were consistent with experimental results.en_US
dc.language.isoen_USen_US
dc.subjectCOMSOL simulationsen_US
dc.subjectheat dissipationen_US
dc.subjectthermal managementen_US
dc.subjectvertical-cavity surface-emitting lasers (VCSELs)en_US
dc.titleEffect of Thermal Management on the Performance of VCSELsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2020.3007724en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume67en_US
dc.citation.issue9en_US
dc.citation.spage3736en_US
dc.citation.epage3739en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000562091800036en_US
dc.citation.woscount0en_US
Appears in Collections:Articles