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dc.contributor.authorFu, Yi-Kengen_US
dc.contributor.authorLu, Yu-Hsuanen_US
dc.contributor.authorXuan, Rongen_US
dc.contributor.authorChao, Chia-Hsinen_US
dc.contributor.authorSu, Yan-Kuinen_US
dc.contributor.authorChen, Jenn-Fangen_US
dc.date.accessioned2014-12-08T15:21:51Z-
dc.date.available2014-12-08T15:21:51Z-
dc.date.issued2012-03-15en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2011.2182606en_US
dc.identifier.urihttp://hdl.handle.net/11536/15550-
dc.description.abstractIn this letter, the numerical and experimental demonstrations for enhancement of light extraction efficiency in near-ultraviolet light-emitting diodes (LEDs) with a roughened backside on the N-face surface of GaN substrate through a chemical wet-etching process are investigated. It was also found that the increased etching time can increase the height of hexagonal pyramids and decrease the density of hexagonal pyramids. With 20-mA injection current, it was found that forward voltages were 3.13 and 3.16 V while output powers were 13.15 and 27.18 mW for the conventional LED and roughened backside LED, respectively.en_US
dc.language.isoen_USen_US
dc.subjectChemical wet-etchingen_US
dc.subjectGaNen_US
dc.subjectlight extractionen_US
dc.subjectnear-ultraviolet light-emitting diode (NUV LED)en_US
dc.subjectsimulationen_US
dc.titleOptical Simulation and Fabrication of Near-Ultraviolet LEDs on a Roughened Backside GaN Substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2011.2182606en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume24en_US
dc.citation.issue6en_US
dc.citation.spage488en_US
dc.citation.epage490en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000300847400009-
dc.citation.woscount0-
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