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dc.contributor.authorHsu, Li-Hanen_US
dc.contributor.authorOh, Chee-Wayen_US
dc.contributor.authorWu, Wei-Chengen_US
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorZirath, Herberten_US
dc.contributor.authorWang, Chin-Teen_US
dc.contributor.authorTsai, Szu-Pingen_US
dc.contributor.authorLim, Wee-Chinen_US
dc.contributor.authorLin, Yueh-Chinen_US
dc.date.accessioned2014-12-08T15:21:53Z-
dc.date.available2014-12-08T15:21:53Z-
dc.date.issued2012-03-01en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2011.2171485en_US
dc.identifier.urihttp://hdl.handle.net/11536/15583-
dc.description.abstractThis paper presents a flip-chip-on-board (FCOB) packaging technology using a Rogers RO3210 laminate for microwave applications. Compared to the conventional microwave packaging architecture, the proposed FCOB technology skips one level of the ceramic package and thus results in lower reflections and manufacturing costs. To fulfill the small dimension requirement on printed circuit boards, the coplanar waveguide (CPW) transmission line and flip-chip bump were fabricated on a high-k RO3210 board (epsilon(r) = 10.2) with photolithography and electroplating. The GaAs chip patterned with the CPW line was then flip-chip-mounted onto the RO3210 laminate board. This structure displayed excellent performance from dc to 50 GHz with a return loss S-11 greater than 18 dB and insertion loss S-21 less than 0.5 dB. Meanwhile, the flip-chip bonding of the in-house-fabricated In0.52Al0.As-48/In0.6Ga0.4As metamorphic high-electron-mobility transistor devices on RO3210 also displayed excellent gain performance with a small degradation of 1 dB from dc to 40 GHz, showing the potential of implementing microwave integrated circuits on RO3210. To enhance the mechanical reliability, an epoxy-based underfill was injected into the flip-chip assemblies. Thermal cycling tests were performed to test the interconnect reliability, and the results indicated that the samples passed the thermal cycling test at least up to 600 cycles, showing excellent reliability for commercial applications. To the best of the authors' knowledge, this is the first study that evaluates the use of the RO3210 laminate for microwave flip-chip in open literature.en_US
dc.language.isoen_USen_US
dc.subjectCoplanar waveguideen_US
dc.subjectfabricationen_US
dc.subjectflip-chip-on-boarden_US
dc.subjectinterconnecten_US
dc.subjectmetamorphic high-electron-mobility transistor deviceen_US
dc.subjectmicrowaveen_US
dc.subjectpackagingen_US
dc.subjectreliabilityen_US
dc.subjectRO3210 laminateen_US
dc.subjectunderfillen_US
dc.titleDesign, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHzen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCPMT.2011.2171485en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume2en_US
dc.citation.issue3en_US
dc.citation.spage402en_US
dc.citation.epage409en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000301237100006-
dc.citation.woscount3-
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