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dc.contributor.authorLo, Wen-hungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorDai, Chih-Haoen_US
dc.contributor.authorChung, Wan-Linen_US
dc.contributor.authorChen, Ching-Enen_US
dc.contributor.authorHo, Szu-Hanen_US
dc.contributor.authorCheng, Osberten_US
dc.contributor.authorHuang, Cheng Tungen_US
dc.date.accessioned2014-12-08T15:21:54Z-
dc.date.available2014-12-08T15:21:54Z-
dc.date.issued2012-03-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2011.2177956en_US
dc.identifier.urihttp://hdl.handle.net/11536/15592-
dc.description.abstractThis letter investigates the impact of mechanical strain on gate-induced floating-body effect in partially depleted silicon-on-insulator p-channel metal-oxide-semiconductor field-effect transistors. The strained FB device has less NBTI degradation than unstrained devices. This behavior can be attributed to the fact that more electron accumulation induced by strain effect reduces the electric oxide field significantly during NBTI stress. Analysis of the body current (I-B) under source/drain grounded and floating operation indicates an increase in the anode electron injection and electron tunneling from conduction band which occur at the partial n(+) poly-Si gate and Si substrate, respectively. This phenomenon can be attributed to the bandgap narrowing which has been induced by the strain effect.en_US
dc.language.isoen_USen_US
dc.subjectGate-induced floating-body effect (GIFBE)en_US
dc.subjectnegative bias temperature instability (NBTI)en_US
dc.subjectsilicon-on-insulator (SOI) MOSFETsen_US
dc.subjectstrained siliconen_US
dc.titleImpact of Mechanical Strain on GIFBE in PD SOI p-MOSFETs as Indicated From NBTI Degradationen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2011.2177956en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume33en_US
dc.citation.issue3en_US
dc.citation.spage303en_US
dc.citation.epage305en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000300580000001-
dc.citation.woscount12-
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