完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWang, Dwo-Wenen_US
dc.contributor.authorTsai, Wen-Chihen_US
dc.contributor.authorYin, Ching-Chungen_US
dc.date.accessioned2014-12-08T15:22:23Z-
dc.date.available2014-12-08T15:22:23Z-
dc.date.issued2009en_US
dc.identifier.isbn978-3-908158-22-6en_US
dc.identifier.issn1662-0356en_US
dc.identifier.urihttp://hdl.handle.net/11536/15851-
dc.description.abstractThis paper presents a novel method to monitor the bonding condition of active fiber composites (AFCs). AFCs can be used as integrated acoustic sensors/actuators to compose functional structures because of their excellent properties. Debonds between AFC patch and host structure should be avoided and surveyed through its service life. A partially debonded patch bears an axial extensional vibration which is excited by a sinusoidal voltage and detected by the interdigital electrodes symmetrically aligned on opposite surfaces of the patch. The electric impedance and mechanical displacement of the AFC patch adhered on an aluminum plate were investigated in a broad frequency range. The modal characteristics depend on the size of debond and stiffness of adhesive in front of the edge of delamination. The debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of self-detecting the progressive delamination between AFC patch and host plate is demonstrated through computational and experimental results.en_US
dc.language.isoen_USen_US
dc.subjectActive Fiber Compositesen_US
dc.subjectdelaminationen_US
dc.subjectimpedanceen_US
dc.subjectresonanceen_US
dc.titleSelf-detection of Delamination in Active Fiber Compositesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalEMBODING INTELLIGENCE IN STRUCTURES AND INTEGRATED SYSTEMSen_US
dc.citation.volume56en_US
dc.citation.spage447en_US
dc.citation.epage452en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000265014200062-
顯示於類別:會議論文