The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering

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DC 欄位	值	語言
dc.contributor.author	Huang, Y. S.	en_US
dc.contributor.author	Hsiao, H. Y.	en_US
dc.contributor.author	Chen, Chih	en_US
dc.contributor.author	Tu, K. N.	en_US
dc.date.accessioned	2014-12-08T15:22:41Z	-
dc.date.available	2014-12-08T15:22:41Z	-
dc.date.issued	2012-05-01	en_US
dc.identifier.issn	1359-6462	en_US
dc.identifier.uri	http://hdl.handle.net/11536/16017	-
dc.description.abstract	We report new findings in Ni/SnAg solder/Cu microbumps having a reduced solder thickness in the range of 40-10 mu m; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 mu m solder/Cu samples., the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 pm due to the change in Cu and Ni concentration gradients in the solder. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	Diffusion	en_US
dc.subject	Intermetallic	en_US
dc.subject	compounds	en_US
dc.subject	Soldering	en_US
dc.subject	Copper	en_US
dc.subject	Nickel	en_US
dc.title	The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering	en_US
dc.type	Article	en_US
dc.identifier.journal	SCRIPTA MATERIALIA	en_US
dc.citation.volume	66	en_US
dc.citation.issue	10	en_US
dc.citation.epage	741	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000302756400006	-
dc.citation.woscount	6	-
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