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dc.contributor.authorHuang, Y. S.en_US
dc.contributor.authorHsiao, H. Y.en_US
dc.contributor.authorChen, Chihen_US
dc.contributor.authorTu, K. N.en_US
dc.date.accessioned2014-12-08T15:22:41Z-
dc.date.available2014-12-08T15:22:41Z-
dc.date.issued2012-05-01en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://hdl.handle.net/11536/16017-
dc.description.abstractWe report new findings in Ni/SnAg solder/Cu microbumps having a reduced solder thickness in the range of 40-10 mu m; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 mu m solder/Cu samples., the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 pm due to the change in Cu and Ni concentration gradients in the solder. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectDiffusionen_US
dc.subjectIntermetallicen_US
dc.subjectcompoundsen_US
dc.subjectSolderingen_US
dc.subjectCopperen_US
dc.subjectNickelen_US
dc.titleThe effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state solderingen_US
dc.typeArticleen_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume66en_US
dc.citation.issue10en_US
dc.citation.epage741en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000302756400006-
dc.citation.woscount6-
Appears in Collections:Articles


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